Capabilities

PCB engineering from architecture to production release.

Senior-level implementation for complex electronics, with the technical depth to balance electrical intent, physical constraints, manufacturing capability, reliability, cost, and schedule.

01

PCB Design & Layout

Schematic interpretation, placement strategy, constraint-driven routing, stack-up planning, HDI, rigid-flex, flex, dense multilayer, and compact form-factor implementation.

02

High-Speed Digital

Controlled impedance, differential interfaces, DDR and memory buses, Ethernet, USB, PCIe, clocks, timing-sensitive routing, return-path control, and signal-integrity-aware layout.

03

RF, Wireless & Antennas

Sub-GHz, cellular, GNSS, Bluetooth, Wi-Fi, NFC, RFID, RF front ends, antenna integration, matching networks, filtering, shielding, grounding, and isolation.

04

Power, Analog & Mixed Signal

Power-tree implementation, switch-mode supplies, precision analog, sensor interfaces, data converters, current paths, thermal management, and noise-domain separation.

05

Advanced PCB Technologies

Microvias, via-in-pad, blind and buried vias, fine-pitch BGA escape, mixed stack-ups, sequential lamination, heavy copper, controlled depth, and technology selection.

06

Mechanical & System Integration

Board outlines, keep-outs, connector strategy, enclosure interfaces, component height management, flex dynamics, cable access, assembly constraints, and 3D coordination.

07

EMC, Reliability & Review

EMI risk reduction, filtering and protection, grounding strategy, creepage and clearance, derating awareness, design review, failure analysis, and redesign support.

08

DFM, DFA & DFT

Fabricator rule alignment, assembly-aware layout, test-point planning, panel and programming considerations, BOM risk awareness, fabrication drawing review, and supplier questions.

09

Libraries & Design Data

Verified footprints, symbols, padstack strategy, part data governance, constraint setup, documentation standards, revision control, and reusable design-system development.

Release package

Manufacturing data that is clear, complete, and controlled.

Exact outputs are adapted to the CAD platform, product stage, supplier workflow, and customer configuration requirements.

Primary EDA platforms: Siemens PADS PCB, Cadence Allegro, and Altium Designer.

  • Native CAD design database
  • Fabrication and assembly outputs
  • ODB++ / IPC-2581 or Gerber data
  • Drill and routing files
  • Pick-and-place data
  • Assembly and fabrication drawings
  • Impedance and stack-up notes
  • Design review and release checklist

Technical review

Need a difficult board assessed?

Provide the product stage and principal constraints. A focused review can define the right scope before layout begins.

Discuss the requirements